On March 17, according to Taiwan media 《经济日报》, after Micron, a major American DRAM manufacturer, hired Liu Deyin, the former chairman of TSMC, as a director, recently Micron also came to the Taiwan-based DRAM packaging and testing leader Licheng, expanding DRAM out-of-commissioned packaging and testing orders, and the order volume this time increased by 50%, which is expected to significantly push up容量利用率和性能。

Licheng对未来市场的前景也很乐观，并预计将在第二季度恢复整体的DRAM市场。列竹董事长Cai Dugong在最近的法律会谈会议上强调，与AI相关和高带宽记忆（HBM）包装和测试技术和订单量的持续增长预计将消耗甘蔗今年的运营。

根据统计，Micron在台湾投资了30年。截至2024年，微米在台湾的累计投资已达到11万亿美元，使其成为台湾最大的外国投资者，并与位于台湾的供应链合作伙伴保持良好关系。 Micron现在正在积极开发HBM技术，该技术由于AI应用而急剧上升，并且正在与SK Hynix和Samsung等韩国记忆制造商竞争。

It is reported in the industry that Micron will once again expand HBM production capacity in Taichung factory in Taiwan, China to meet the huge HBM demand of AI customers, and convert the packaging and testing capacity of Taichung factory into high-bandwidth memory packaging and testing, which has caused the existing huge DRAM packaging and testing capacity to be squeezed out and a gap, thus expanding outsourcing orders.

消息来源显示，这次Micron扩大了DRAM包装和测试能力，并发现了Licheng，并有望采用堆叠包装（POP）。 Licheng将在第二季度尽快进入批量生产。 Licheng Pop生产的粗略估计在本季度将增加50，并且容量利用率也将得到显着提高。

行业内部人士分析了Micron和Licheng已经合作了将近十年，双方都有一定的理解和信任。从过去的时候，列明大陆Xi\’an工厂是Micron DRAM和存储闪存（NAND Flash）的外包包装和测试合作伙伴。